Dacuda at Qualcomm

October 6, 2015 —

Last month, we were invited to present at the 2015 Qualcomm 3G/LTE Summit in Hong Kong, which connects OEMs with providers. Among leaders in the manufacturing, operating, and component technology industries, CEO Peter Weigand demonstrated how our SLAM Scan® 3D technology uses regular smartphone cameras to turn smartphones into 3D software cameras.

Our technology generated a lot of interest from OEMs and platform suppliers! We are excited by the awesome response and the possibilities to collaborate.

For more details, the presentations are available for download on the Qualcomm website.