Dacuda at Qualcomm
October 6, 2015 —
Last month, we were invited to present at the 2015 Qualcomm 3G/LTE Summit in Hong Kong, which connects OEMs with providers. Among leaders in the manufacturing, operating, and component technology industries, CEO Peter Weigand demonstrated how our SLAM Scan® 3D technology uses regular smartphone cameras to turn smartphones into 3D software cameras.
Our technology generated a lot of interest from OEMs and platform suppliers! We are excited by the awesome response and the possibilities to collaborate.